In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Nexperia and Semikron Danfoss have signed an MoU to explore a strategic collaboration on SiC-based power modules for automotive traction inverter applications. The collaboration aims to combine ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

Navitas Semiconductor has announced the launch of its new SiCPAK™ power modules, which utilize innovative epoxy-resin potting technology alongside proprietary trench-assisted planar SiC MOSFET ...

With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...

Founded in 2020, Powertrim Technologies is a provider of back-end packaging equipment for power modules. Rooted in over 40 years of semiconductor trim and form toolmaking heritage, the company offers ...

The adoption of N-type modules around the world continues apace, with technologies including TOPCon, HJT and BC rapidly taking a dominant position due to the multiple and significant advantages of ...

How can power modules be manufactured to reliably function under increasing power densities, higher temperatures and new ...

As AI data centres continue to scale, token generation is limited by power availability, while efficiency is a defining factor for return on investment. Traditional architectures based on bulky, ...

Wolfspeed’s 3.3-kV SiC power modules target AI data centers, renewable energy systems, and grid infrastructure.

Microchip Technology (Nasdaq: MCHP) today announces the availability of its new 3.3 kV HV ‑ D3 mSiC ® Power Modules, designed to simplify and accelerate the adoption of solid-state transformers (SSTs) ...